Used TEL / TOKYO ELECTRON P-8XL #293659669 for sale

TEL / TOKYO ELECTRON P-8XL prober is a high-end automated positioning equipment that has the capacity to accurately map, index, and image semiconductor devices. Ideal for complex semiconductor processes such as bump probing, high-density contact probing, scoping, die-bond probing, and IC probing, this prober is designed to provide automated probing capabilities to increase both efficiency and accuracy. TEL P8XL's dual-wafer platform is capable of accurately positioning two wafers simultaneously and supports different types of chuck designs. The system also includes an advanced Auto Chuck Alignment unit which can accurately align the wafers to within 4.98 μm. To streamline the probing operation, TOKYO ELECTRON P8-XL can also control up to 16 probes simultaneously. This prober is designed for both standard wafer indexing applications and unusual wafer or die locations. It is fitted with a low wobble, high-stiffness spindle that is capable of positioning wafers accurately over large distances without miniscule errors. This is accomplished with the help of an advanced encoder and a digital servo-drive machine. It is also designed with an advanced 6-axis robotic arm to recognize a variety of wafer shapes and locations. In addition, you can also take advantage of its advanced Programming for Probe Positioning (PPP) feature. It automatically determines a fast and optimal way of positioning the probes at pre-defined test points, even for wafers that are of different thicknesses or types. TEL / TOKYO ELECTRON P-8 XL is designed to be used with host wafer handling systems, such as TEL Wafer Handler 200, for transport between the wafer indexing station and the probing station. It is also compatible with several types of wafer handling equipment, which makes it ideal for flexible consolidation and communication in an automated environment. In conclusion, TEL P-8 XL is a sophisticated automated prober device that is designed to provide accurate probing capabilities while increasing process efficiency. With its advanced dual-wafer positioning and Auto Chuck Alignment tool, advanced 6-axis robotic arm, and compatibility with variety of wafer handling systems, it is any industrialist's ideal choice for serious semiconductor processing.