Used TEL / TOKYO ELECTRON P-8XL #293671043 for sale

TEL / TOKYO ELECTRON P-8XL Prober is a wafer testing and probing equipment designed for the handling of optical devices, semiconductor wafers, and Film-Form-Fill-Seal packages. This system is designed to improve wafer analytical performance and minimize particle contamination for high-density device processing. TEL P8XL Prober is constructed with a compact and ergonomic design that enables efficient and accurate probing and testing for each device. This unit is capable of probing up to 50 wafers per hour with a probing speed of up to 1.2m/s. The machine also has an automated wafer mapping feature which displays the measurement results of each device to the monitor in real time. The tool boasts an ultra-high speed, a precision differential control and an optimized isolation sensor. The ultra-high speed enables TOKYO ELECTRON P8-XL Prober to provide precise measurement with minimal physical stress to the device under test. The precision differential control feature maintains a high degree of accuracy while the optimized isolation sensor ensures accurate readings of de vice parameters, such as logic thresholds and voltage levels. TEL P-8XL Prober also features a sophisticated pin polarity discrimination feature which can detect pin-poling that may occur during the probing process. This helps to eliminate errors and protect against damage to the device under test. TEL P 8 XL Prober is fully integrated with TEL Proberizer software package, which provides a complete solution for advanced user programming and control. This software package enables users to customize the scanning area, probe locations, speed, and power levels. The Proberizer also includes an extensive library of simulation methods which result in greater accuracy and repeatability for device testing. P-8 XL Prober is an ideal asset for the testing and probing of optical devices, semiconductor wafers, and Film-Form-Fill-Seal packages. This model provides superior performance and reliability while maintaining a high degree of accuracy and minimizing physical stress to the device under test.