Used TEL / TOKYO ELECTRON P-8XL #9180573 for sale

TEL / TOKYO ELECTRON P-8XL is a prober developed for high accuracy probing and testing of semiconductor wafers. It is a multi-functional prober that supports testing and probing of a variety of types such as wafers, bond pads and multi-die wafers. TEL P8XL includes an advanced image analysis algorithm for efficient wafer alignment and positioning, enabling high accuracy wafer probing and testing. The prober also supports the full range of SEMI standard wafer sizes, from 8" to 12" (200 mm to 300 mm). TOKYO ELECTRON P8-XL is equipped with an improved and reliable 12-axis mechanism for wafer movement and probing. The position control is accurate to 0.001 mm using a micro meter scale equipment, which enables high accuracy probing. It also features an ultra-accurate alignment algorithm for uniformity controls of the wafer positions. Furthermore, the prober is configured with an intuitive user interface with graphic editing capabilities to select testing and probing patterns. With its advanced image analysis algorithm, TEL / TOKYO ELECTRON P8XL is capable of probing multiple die wafers in a single testing run. This time-saving feature improves the throughput and productivity of the wafer probing and testing process. Additionally, the prober comes with a motion control system and software for efficient testing, probing and position control. This helps to eliminate potential alignment or positioning errors which can lead to faulty results. To support high accuracy probing and testing, P-8XL is also equipped with a precise and reliable servo unit for wafer movement and a linear motor drive machine for efficient wafer scanning. The prober also features an optional adjustable Z-axis, which can be used to adjust the contact force and gap between the probe and the wafer for optimal contact performance. Furthermore, a temperature cycling function is also included for more precise temperature control during the probing process. Overall, TEL P8-XL is a reliable and accurate prober capable of testing and probing a wide range of wafers. Its advanced image analysis and motion control systems ensure high accuracy probing and testing. Additionally, its multi-functional design and flexible options make it ideal for testing and probing multiple die wafers in a single run, thereby increasing the throughput and productivity of the probing and testing processes.