Used TSE / MPI LEDA-6SFA #293757354 for sale

Manufacturer
TSE / MPI
Model
LEDA-6SFA
ID: 293757354
Vintage: 2008
Semi-auto wafer prober 2008 vintage.
TSE / MPI LEDA-6SFA is a prober that has been specifically designed and developed for use in advanced semiconductor production processes. It is an ideal prober for inspecting and testing integrated circuits (ICs) with sizes ranging from 0.5mm up to 120mm, and for probing areas as small as 25 microns. The prober features a six-axis motion equipment that allows for accurate, repeatable, and rapid probing of different device structures. This motion system allows the prober to effectively access different points on the device, while also compensating for the wafer tilt and pitch. The optical unit is designed to reduce the overall settling time and offer superior accuracy. In addition, the prober uses multi-level alignment technology. This allows the prober to align to multiple planes of different wafer orientations. The high level of alignment accuracy ensures the accurate placement of contact tips on next-level devices. The prober also features a unique high-speed multi-die prober that enables fast probing for multiple die at the same time. This multi-die prober can accurately access and probe even the most challenging devices with high yield rates. The prober also uses a low noise architecture, which helps reduce noise interference and ensures high yields. The prober is designed with multiple probes, with each probe providing independent independent contact pressure regulation and repeatable contact pressure. This helps reduce contact damage, and allows for more accurate probing. The prober also uses a high-performance, closed loop wafer tracking machine. This tool provides unmatched accuracy when probing difficult dies. Additionally, it includes a remote calibration module, which allows customers to monitor and analyze the prober's performance. Overall, TSE LEDA-6SFA prober is an ideal solution for performing accurate and high-yielding probing and inspection of advanced semiconductor chips. Its high-speed multi-die prober, accurate alignment asset, low-noise architecture, and remote calibration module makes it an excellent choice for production processes.
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