Used TSE / MPI LEDA-6SFA #9395487 for sale

TSE / MPI LEDA-6SFA is a contact/non-contact prober designed for the automated die or package level contact testing of electronic devices. This advanced prober technology offers a comprehensive range of applications including test interface, contact test, die level testing, final ship testing, probing, module insertion and removal analysis, functional and contact testing, burn-in and simulation, autofocus control, high-speed contact accuracy assessment, stress/contact cycle testing, and thermal shock testing. TSE LEDA-6SFA designed to meet the industrial standards for quality and accuracy in the semiconductor industry. The model is a completely automated equipment that offers a full six-axis stage for the die level testing of wafers and other electronics. The model is equipped with an integrated die-level prober, contact sensing system, and an automated wafer mover controlled by a state-of-the-art CNC controller. As an added benefit, it can also be equipped with a wide range of probing mechanisms to meet the needs of specific applications. The model allows for manual die/package alignment and autofocus control. MPI LEDA-6SFA features a 2.85 μm step-size accuracy, 10 MHz data rate, and a superior die-level tester accuracy. In addition, it also features a high-speed thermal shock capability, which allows for quick-testing of up to 100 wafers at a time. The design also incorporates the latest in isolator technology, ensuring that any electrical noise induced from adjacent devices or equipment do not interfere with the testing process. LEDA-6SFA also offers a complete range of testing capabilities, including built-in functional test, contact tests, Wi-Fi testing, camera testing, IC test, floppy drive test, and OEM test protocols. These features allow for a comprehensive testing platform in a single, integrated unit. TSE / MPI LEDA-6SFA is equipped with a unique machine configuration, allowing it to be used for various applications. Overall, TSE LEDA-6SFA is an advanced prober technology, designed to meet the high standards of the semiconductor industry. With its superior accuracy, a wide range of testing capabilities, and a comprehensive range of applications, it is an ideal solution for contact/non-contact testing of electronic devices.