Used TSE W7000 #9144244 for sale

TSE W7000
Manufacturer
TSE
Model
W7000
ID: 9144244
Vintage: 2011
Probers 2011 vintage.
TSE W7000 is an advanced prober designed to precisely measure and test products with high accuracy, repeatability, and reliability. It is able to conduct measurements of up to 10μm accuracy, making it perfect for precision applications such as semiconductor wafer and chip level packaging. W7000 is equipped with a unique dual die probing head which allows for testing multiple pins simultaneously, enabling higher throughput in production testing. The prober is also equipped with an automated binning and sorting equipment, allowing for products to be quickly and accurately classified and sorted. Additionally, the prober is equipped with a 3-axis motion stage and has adjustable speed and acceleration to help reduce setup time and ensure efficient operation. TSE W7000 is equipped with an advanced control system for managing the measurement, testing, and sorting. It uses a high-performance Motion Control Interface (MCI) for coordinating the prober's mechanical and electrical components, and a specialized parameter editor for setting the desired control settings. Additionally, the unit includes an intuitive graphical user interface (GUI) that allows for easy setup and operation. W7000 can be configured with a variety of probes, fixtures, and accessories, allowing for customized setup for specific applications. It features a modular hydraulic machine with variable pressure control for efficient and consistent contact force. The prober supports a range of programmable devices, such as pointers, CCD cameras, and lasers, allowing for a variety of measurement techniques. Additionally, it can be configured with a wide range of temperature control and measurement systems, enabling efficient and precise temperature control for testing and production. In summary, TSE W7000 is an advanced prober designed for precision measurement and testing applications. Its dual die probing head, high accuracy, and automated binning and sorting make it ideal for semiconductor wafer and chip level production testing. The tool is equipped with a 3-axis motion stage and programmable devices, allowing for a variety of testing techniques. Additionally, its modular hydraulic asset and temperature control and measurement capabilities enable efficient and accurate operations.
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