Used ASM Siplace SX1 #9131258 for sale

ASM Siplace SX1 is a leading pc board assembly and manufacturing equipment that is used by the electronic industry on the production floor. It is designed to be completely flexible and configurable to suit the individual needs of the user. It is equipped with an advanced vision system, allowing for greater accuracy in the placement of components. It can also be integrated with other existing equipment to provide an even more automated manufacturing process. Siplace SX1 offers a comprehensive array of features. It is a fully configurable unit, allowing for customizing the placement and assembly of components based on the specific needs of the user. The machine is also able to handle multiple substrates, including chip on board, flex and rigid/flex boards, and fine pitch devices. Additionally, it features advanced placement accuracy and features such as X,Y, Zure compensation, speed control, and substrate thickness compensation. It also has a built-in vacuum tool for efficient handling of components. ASM Siplace SX1 also includes a software package that allows for workstation control, programmable process parameters, and network connectivity. The software offers an intuitive user interface, graphical work flow control, and off-line programming capability. It also has advanced analytical tools, such as chip recognition, maximum component stack-up height calculation, and placement check including error message corrections. Additionally, it includes a wire bonding feature, which allows for the connection of components in controlled environments. Siplace SX1 is also designed for easy maintenance. Service access points make it easy for operators to troubleshoot and maintain the asset, eliminating costly downtime. The model is equipped with an advanced vision equipment and ultrasonic/mechanical feedback system for precise placement and positioning. In conclusion, ASM Siplace SX1 is a highly efficient and reliable pc board assembly and manufacturing unit that offers advanced features, including automated wafer bonding, off-line programming, and advanced process parameters. It is an ideal solution for the electronic industry, providing increased accuracy, flexibility, and cost savings.