Used OXFORD Plasmalab 100 #9088671 for sale

It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.

ID: 9088671
PECVD / ICP Loadlock cluster system - up to 8" PECVD & ICP Computer - HP/ KAYAK operating Windows 98 The Oxford software is PC200 version 2.57.96 Controllers (PLC) 2 each of MCGE432022 Gases PECVD 200 sccm BCl3 100 sccm Cl2 200 sccm Ar 100 sccm NH3 200 sccm CF4 100 sccm O2 Gases ICP 2 SLPM 2% SiH4 100 sccm N2O 2 Slpm N2O 1000 sccm N2 The pumps with the system are: Leybold D40BCS Ruvac WSU250 Leybold D25BCS ICP unit has a Laser Reflectometer, SC Technology #220 PECVD has intermittent failure: mechanical pump shut off unexpectedly RIE is missing mechanical backing pump to the main process turbo pump 1996 vintage.
OXFORD Plasmalab 100 is an etcher / asher designed to deliver fast and accurate etching/ashing of wafer materials. Optimized for high uniformity performance, Plasmalab 100 offers a range of features for deposition, etching and stripping of advanced substrate materials. OXFORD Plasmalab 100 is equipped with a robust plasma source, which ensures precise control of process conditions. This includes gas mass flow, pressure and temperature regulation, and reaction chamber liner. To ensure the highest uniformity and best processing performance, the accurate tuning of process parameters is ensured. Furthermore, the magnetic field used in the reaction chamber ensures uniform energy distribution of the plasma. The device can also be easily configured for various etching and ashing applications such as deep-level etching, overetch and selective etching. In terms of process quality control, Plasmalab 100 is equipped with optical emission spectroscopy (OES) which provides real-time feedback on the etching/ashing process. This helps to ensure process consistency and accuracy. Furthermore, the repeatability of the process is maintained by fast and accurate process control parameters. Finally, the device is user-friendly, with a full color touchscreen display. OXFORD Plasmalab 100 is capable of handling wafer substrates up to 200 mm in diameter and up to 1 mm thick. It supports different temperature ranges, up to 1000°C, and different process gases such as Ar, H2, N2, and O2. Furthermore, Plasmalab 100 is able to handle several etching/ashing recipes and can offer recipe-switch functions, as well as data acquisition and archiving of the process parameters. In summary, OXFORD Plasmalab 100 is an etcher / asher suitable for use in wafer processing applications. It offers precision and repeatability thanks to its robust plasma source, OES, and accurate process control parameters. Furthermore, it supports various etching/ashing recipes, process gases, and temperature ranges.
There are no reviews yet