Used STS 310PC #9082946 for sale
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STS 310 PC is an advanced etching and ashing equipment built to the highest quality standards and designed to meet the most demanding requirements of leading semiconductor device manufacturers. The system combines a compact and sleek design with advanced technology to provide an ideal solution for high production substrate processing. 310 PC etcher and asher unit is built with a unique modular design that allows for quick and easy installation. This modular machine includes capability for up to two etching chambers, two ashing chambers, and adjustable vacuum settings for each chamber. The tool components are designed to be removable, allowing for quick loading and unloading of substrates. The integrated semiconductor cassette loader asset is capable of handling many different sizes of wafers and substrates. STS 310 PC etcher and asher model is equipped with an integral vacuum equipment that can be adjusted with precision to meet specific processing requirements. The system's advanced process monitoring and control offers high precision etching and ashing capabilities. In addition to the advanced technological features, the unit is also designed with user safety in mind, offering emergency features that can be activated with the push of a button. For improved performance and reliability, 310 PC etcher and asher machine is built with an air monitoring and scrubbing tool that includes automatic shut down of chambers if contaminant levels exceed safe limits. To optimize asset operation and reduce maintenance, the model is equipped with an auto-loader purging equipment, along with anti-clogging systems for the wafer cassettes. Additionally, the system is designed with low pressure exhausts to reduce particle buildup around the unit, and PLC-controlled temperature control to ensure accurate processing of substrates. The advanced STS 310 PC etcher and asher machine is designed to meet the toughest semiconductor processing requirements while adhering to industry standard safety requirements. This sophisticated tool is capable of achieving the highest levels of precision and reliability and is uniquely suited for medium to high volume substrate processing.
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