Used ELECTROVERT Infraflo 250 #9221379 for sale

ID: 9221379
Vintage: 1993
Oven Single element Technical documentation included Maximum temperature: 340°C Spare parts: Conveyor Various electrical components Power requirements: 208 V, 3-Phase 1993 vintage.
ELECTROVERT Infraflo 250 is an industrial reflow oven that is designed for a wide range of activities in the production of printed circuit boards (PCBs). It is a high-end, high-tech machine that is used to rapidly heat and cool PCBs to facilitate the bonding of component parts and other assembly tasks. Infraflo 250's three-zone design offers optimal heat control, as each of the oven's three zones can be set to its own temperature within a wide range. This allows users to heat and cool rapidly for thermal shock tests, or to go from one temperature preset to another for complex reflow applications. In addition, the oven is equipped with a powerful variable speed fan that ensures uniform temperature distribution across the board surface for even and consistent heat distribution. Furthermore, it is designed to accommodate multiple board formats, and is capable of cooling individual boards to lower temperatures than typical reflow ovens due to its sophisticated cooling system. ELECTROVERT Infraflo 250 has an intuitive control panel with an easy-to-use interface that allows for quick setup and precise temperature selection. On the oven exterior, a digital thermometer displays oven temperature, and the temperature range can be programmed into the control unit, as well as stored in pre-set recipes for repeatable runs. Additional features such as multi-zone offset settings, cool start, and fault detection specification, as well as four programmable settings for different temperatures, provide greater flexibility and control over the reflow process. Furthermore, Infraflo 250 is equipped with a built-in humidity sensor to ensure peak board performance and to prevent overheating. Overall, ELECTROVERT Infraflo 250 reflow oven offers an ideal solution for PCB production. Its intelligent design, precise digital temperature control, and advanced cooling systems allow users to quickly and accurately heat and cool PCBs for reflow soldering, eliminating the need for manual intervention and increasing the speed and accuracy of the process.
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