Used ELECTROVERT / SPEEDLINE OmniFlow 7 #9268024 for sale

ELECTROVERT / SPEEDLINE OmniFlow 7 is a multi-purpose, high-performance reflow oven equipment for dynamic controller and processor soldering, with special features for thermal processing. SPEEDLINE OmniFlow 7 is designed with a non-contact gas and air heat transfer technique that is highly effective and dependable for the mass production of advanced micro-electronics and PCB assemblies. The temperature control systems and process parameters provide precise control and exact process repeatability even when faced with a variety of challenging reflow applications. The oven is designed for low maintenance, durability, and ease of use. Its robust construction and versatile application system provide an ideal reflow workstation for operators of all levels. The thermal chamber is constructed with a thick-walled reinforced steel chassis with NEMA-rated componentry to ensure safety and reliability. The heavy-duty center hanger assembly is adjustable for use with a variety of board sizes, depths and charging levels. The chamber has a temperature range of 100°F to 700°F (38°C to 370°C) with an accuracy of ± 4°F (± 2°C). The reliable uniformity of the thermal zone is ensured with the combination of infrared and convection heat transfer techniques. The Ten-zone hot air profile process is easily implemented through the user-friendly controller. With the user-friendly menu-based command set, process data is always stored and can be recalled at any time. ELECTROVERT OmniFlow 7 is an impeccably designed closed loop reflow oven. Its closed loop heater control helps protect the heating element from overheating, and its closed loop temperature controllers, PID/Watlow controllers, guarantee an accurate temperature profile. As an added feature, the 7-zone low emission hot air unit prevents thermal degradation of sensitive components and eliminates hot gas exhaust blowback. OmniFlow 7 offers customers a variety of additional components for overall machine customization. The flexible cooling tool utilizes forced coolant to evenly cool the board surface and prevents residual heat. For process capability on solder print coverage, the 24-inch 18-Cup Paste Jet Asset allows for full board coverage while producing efficient paste droplet patterns. For heavy throughput acceleration, there is an optional board turnover model which can increase processing speed by up to 70%. ELECTROVERT / SPEEDLINE OmniFlow 7 is an excellent choice for efficient, reliable, and cost-effective mass production of advanced micro LED, Processor, and PCB assemblies. Its robust thermal control systems, along with added components for customization, make it the ideal work station.