Used ERSA Hotflow 2/12 #293751971 for sale
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ID: 293751971
Vintage: 2006
Reflow oven
Heating zone
PCB Support
Cooling zone
Oxygen monitoring and control
Inline interface
Pass trough control
Temperature profiling system
Autoprofiler
Pin and chain conveyor
Power supply: Conveyor, Hood, PLC
PC Arm and touch screen
Transport speed adjustment: 0.2-2.0 m/min
Plate width: 50-500 mm
(4) Heating modules
Cooling zone with (2) Upper cassettes and integrated water cooled heat exchanger
Condensation
Fume filtration system
Fan speed control
Temperature control
Chain lubrication system
PC
Laptop
Safety device:
Main switch
(4) Emergency-stop buttons
Exhaust monitor
Fan monitoring module
Dimension:
Length: 3860 mm
Width: 1400 mm
Height: 1370 - 1500 mm
Height (open): 1720-1850 mm
Paint: RAL 7016/7035
Process zone:
Process length: 2540 mm
Heating zone: 1700 mm
Cooling zone: 840 mm
Infeed/Outfeed zone: 650 mm
Process chamber width: 690 mm
Conveyor system:
Working width: 50-500 mm
Working width with center support: 50-500 mm
Board clearance: +35 / -20 mm
Conveyor speed: 20-200 cm/min
Conveyor height from floor: 820-950 mm
Pin and chain conveyor: 5 mm
PCB length minimum: 80 mm
Heating system:
Convection share: 100%
Gas flow / Module: Approx 500 cu m/h
Convection modules: 6 Top / 2-6 Bottom
Preheating: 4 Top / 4 Bottom (Option)
Soldering zone: 2 Top / 2 Bottom
Capacity module: 3 kW / 400 V
Cooling:
Zone: ERSA Cooling system
Coolant: Water / Air
Ambinet temperature: 10-35°C
Exhaust rating:
Stack: 2 x Φ 150 mm, 5.9"
Volume per stack: 400 m³/h
Noise level: < 70 dB (A)
Electrical data:
Power: 5 Wires, 3 x 400 V, N, PE
Power tolerance range: ± 10%
Frequency: 50/60 Hz
Maximum fuse rating: 3 x 80 A
Nominal rating: 35 kW-48 kW
Reduced rating: 44 kW
2006 vintage.
ERSA Hotflow 2/12 is an advanced reflow oven designed for the precise and efficient soldering of electronic components onto printed circuit boards (PCBs). This state-of-the-art equipment is a vital component of the surface-mount technology (SMT) manufacturing process, offering high levels of control and flexibility to meet the demands of modern electronics assembly. The Hotflow 2/12 is equipped with twelve heating zones, allowing for precise temperature profiling across the length of the conveyor system. Each zone is independently controlled to optimize the thermal profile for specific solder paste formulations and component types. This level of control ensures that all components are soldered correctly without the risk of overheating or underheating, resulting in consistent and reliable solder joints. One of the key features of ERSA Hotflow 2/12 is its innovative heating technology. The reflow oven utilizes a combination of convection and radiant heating to achieve rapid and uniform heating of the PCBs. The convection heating ensures that heat is evenly distributed across the board, while the radiant heating element provides additional energy to facilitate the soldering process. This dual heating method results in fast ramp-up times and precise temperature control, making the Hotflow 2/12 ideal for high-volume production environments. The Hotflow 2/12 is also equipped with advanced cooling capabilities to prevent thermal shock and ensure the integrity of the components and PCBs. The cooling zone features a carefully controlled airflow system to rapidly reduce the temperature of the assemblies after soldering, minimizing the risk of damage to sensitive components. This rapid cooling process helps to improve the overall quality and reliability of the solder joints, reducing the likelihood of defects and failures in the finished products. In addition to its precise heating and cooling capabilities, ERSA Hotflow 2/12 offers a range of user-friendly features to streamline the reflow soldering process. The oven is equipped with a user-friendly touchscreen interface that allows operators to easily program and monitor the temperature profiles, conveyor speed, and other key parameters. This intuitive interface simplifies the setup and operation of the oven, reducing the potential for human error and ensuring consistent results. Furthermore, the Hotflow 2/12 is designed with a robust and durable construction to withstand the rigors of continuous operation in a production environment. The oven is built with high-quality materials and components that are resistant to heat and corrosion, ensuring long-term reliability and minimal maintenance requirements. This rugged construction makes the Hotflow 2/12 an excellent investment for electronics manufacturers looking to enhance the efficiency and quality of their soldering processes. Overall, ERSA Hotflow 2/12 reflow oven is a versatile and reliable solution for the precise soldering of electronic components in SMT production. With its advanced heating technology, precise temperature control, and user-friendly features, the Hotflow 2/12 offers a high level of performance and flexibility to meet the evolving needs of the electronics industry. Whether used for prototyping, small-batch production, or high-volume manufacturing, the Hotflow 2/12 is a valuable tool for achieving consistent and high-quality solder joints in modern electronic assemblies.
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