Used ERSA Hotflow 2/20 #9406953 for sale

ERSA Hotflow 2/20 is a reliable benchtop reflow oven suitable for low to medium-volume production and prototyping of printed circuit boards. The oven is provided with a 20-segment programmable profile, allowing users to quickly reprogram the heating cycle to match the requirements of the various paste formulations and component types on the board. The oven also features a heat-resistant Kevlar belt conveyor and an independent vacuum generation equipment to improve its reflow quality. The Hotflow 2/20 utilizes a highly efficient forced hot air circulation system with efficient heat transfer characteristics, providing a uniform temperature profile throughout the reflow furnace's work chamber. The oven can work with a diameter flux range of -50°C to 260°C in a continuous cycle and is ideal for accommodating various application requirements. Its zoning capabilities make it possible to reflow different elements while maintaining a stable temperature environment within the oven. The Hotflow 2/20 offers the flexibility to customize heating cycles via its user-friendly controller interface and displays real-time temperature profile data. Its six-step programmable heating ramp allows users to pre-program the desired desired rate of temperature increase. The Hotflow 2/20 reaches its peak temperature in less than 10 minutes and is equipped with an over-temperature sensor for protection against over-heating of components. The Hotflow 2/20 requires a 9 sq. ft. working area and is capable of managing workspaces up to 3.2"x3.2"x3". It has total power consumption of 2500W and is powered using standard 220V/110V AC power supply. It features door interlock unit to maximize safety of operators and the environment and may be connected to a standard ventilation machine to keep the work area clean. ERSA Hotflow 2/20 is ideal for small and medium-volume production, providing users with superior reflow performance. Its user-friendly interface, reliable features and efficient heating tool ensures reliable and accurate reflow process of various paste and component types.