Used ERSA Hotflow 3/20 #293619170 for sale

ERSA Hotflow 3/20
Manufacturer
ERSA
Model
Hotflow 3/20
ID: 293619170
Reflow oven Dual lane F-M-M-F Process tunnel with PCB clearance (Top / Bottom): +25 mm / -35 mm In-feed length: 700 mm Process length: 5,150 mm Heating length: 3,700 mm (10) Preheating zones Cooling length: 1,450 mm (4) Cooling zones Out-feed length: 700 mm Retractable heating modules Programmable chain lubrication Exhaust function monitor Operating state indicator PC Controller TFT Monitor Operation system: Windows 10.
ERSA Hotflow 3/20 is a reflow oven specifically designed for lead-free soldering of SMD components in small- and medium-sized series production. The oven offers reliable automatic soldering for the accommodation of boards up to 250 x 310 mm. Its manual conveyor-belt transport and heating system allow for precise and consistent filling of the product area and short cycle times. The large 3/20 work chamber allows for two conveyor-belt levels with a 200 mm gap. Each belt has a width of 200 mm and can be heated up to 450 °C. This makes ERSA Hotflow 3/20 suitable for applications such as potting, soldering and even reworking of delicate SMD components. ERSA Hotflow 3/20 is equipped with a powerful high-voltage transformer to ensure a consistent power supply and homogeneous heat distribution. This allows for a wide range of soldering profiles which can be precisely adjusted depending on the application. The oven's unique recirculation system amplifies the thermal mass of the chamber and achieves an even heat distribution throughout it, reducing temperature deviations and avoiding process defects. The user-friendly control panel of the oven makes it easy to monitor and adjust the soldering parameters. The LED-displays show the current temperature, profile and status. The temperature can be manually adjusted, as well as set to automatic mode. The system also provides overload protection, over-temperature protection and adjustable gaps between boards. ERSA Hotflow 3/20 is suitable for plates up to 200 x 250 mm and a maximum board weight of 1.5 kg. It consumes a power of 13 kW and can reach a maximum temperature of 450°C, allowing for the soldering of different SMD components, including SOTs and QFNs. Furthermore, the oven is equipped with an exhaust that starts automatically when the set temperature of the oven is exceeded and provides a safe working environment
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