Used ERSA Hotflow 3/20 #9377007 for sale

Manufacturer
ERSA
Model
Hotflow 3/20
ID: 9377007
Vintage: 2013
Reflow oven (10) Heating zones PCB Support Water cooling system Nitrogen setup Smema UPS 7-top side preheating zones 3-top and bottom-side peak zones Automatic chain lubrication Top and bottom-side motor cooling Safety device: Main switch (4) Emergency-stop buttons (2) Exhaust monitors Dimension: Length: 6,590 mm Width: 1,530 mm Height: 1,450 – 1,580 mm Height (open): 1,810 – 1,940 mm Weight: 3,200 kg Paint: RAL 7035/7016 Process zone: Process length: 5,190 mm Heating zone: 3,700 mm Cooling zone: 1,490 mm Infeed/Outfeed zone: 700 mm Process chamber width: 770 mm Conveyor system: Working width: 45 – 580 mm Working width: 45 – 580 mm (PCB center support) Board clearance: +25/-37 mm (Standard) Board clearance: +35/-37 mm (Option) Center support pin height: 15 mm Conveyor speed: 20 – 200 cm/min Conveyor height from floor: 820 – 980 mm Pin-and-chain conveyor: 3 mm Edge clearance (option: 4 mm, 5 mm) Heating system: Convection share: 100% Gas flow / module: approx. 500 m3/h Convection modules: 10 top / 3 – 10 bottom Preheating: 7 top / 7 bottom (option) Soldering zone: 3 top / 3 bottom Nominal rating / module: 3.3 kW Electrical data: Power: 5-wire-system, 3 x 400 V, N, PE Power tolerance range: ±10 % Frequency: 50/60 Hz Max fuse rating: 3 x 100 A Nominal rating: 65 kW – 104 kW Reduced rating: 44 kW Continuous rating for operation: 12 – 19 KW Nitrogen option: Gas injection: in process zone Pressure control: 4.5 – 10 bar Cooling: Cooling zone: Ersa Multinet system Coolant: water / R407C (option) Ambient temperature: 32°C Exhaust rating: Exhaust stacks: 2 stacks, 150 mm, 6" Exhaust volume per stack: 400 m3/h Exhaust monitoring per stack: integrated Noise level: Permanent noise level: < 70 dB (A) 2013 vintage.
ERSA Hotflow 3/20 is a reflow oven designed for high-volume automated soldering applications. The oven is equipped with an advanced, proprietary hot flow technology that utilizes infrared absorbers to provide precise, repeatable temperature control for precision temperature ramping across the entire working zone. The Hotflow 3/20's sophisticated heat flux technology ensures uniform temperature distribution to guarantee consistently reliable manufacturing processes. Unlike traditional reflow ovens, ERSA Hotflow 3/20 requires no external thermocouples, saving setup time and eliminating potential points of failure. This self-regulating technology ensures that operators can achieve a temperature profile that's precisely tailored to their application's needs. The Hotflow 3/20's optimized components also reduce thermal stress on PCBs, leading to improved product reliability. An airlet system constantly circulates cool atmospheric air, bringing a more comfortable environment for operators and reducing the risk of errors. The Hotflow 3/20 reflow oven features a powerful heating system that boasts a heating capacity of up to 20 KW, meaning that it's capable of achieving the temperatures necessary for any soldering task. The Hotflow 3/20 also features a particularly large working zone of 1500mm x 480mm, enabling it to handle even the largest of soldering tasks without compromising uniformity or speed. Standard safety features include an enclosed, recirculated chamber, ensuring operator safety. Additionally, the Hotflow 3/20 includes an energy-saving ECO-mode that automatically monitors and adjusts the heating elements to ensure minimal energy use. The Hotflow 3/20 reflow oven is an affordable, powerful tool that's capable of consistently delivering well-soldered PCBs, even in large production runs. With a reliable heating system, a sophisticated airflow technology, and a simple interface, the Hotflow 3/20 is an ideal choice for any PCB manufacturing operation with automated soldering needs.
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