Used HELLER 112 #114564 for sale

HELLER 112
Manufacturer
HELLER
Model
112
ID: 114564
Axial lead bender, 90º, cascade fed.
HELLER 112 is a reflow oven with a maximum size of 1,008 x 600 mm, capable of holding different substrates of varying dimensions. It enables the reflow of printed circuit boards with high quality and accuracy, ensuring precise temperature control and efficient processing of complicated multilayer boards. 112 utilizes multiple advanced features to ensure reliable and precise temperature control. It has a patented airflow equipment with four individually-controlled top and bottom zones, allowing precise heating of each section to be reached quickly and at more consistent temperatures than other reflow ovens. Furthermore, the precise temperature control system has independent control of each heating zone, along with a special configuration for the profile of each substrate. HELLER 112 also incorporates an advanced vision unit, with an integrated 4-channel analogue vision machine that allows it to automatically identify the substrate and locate components on the board. The board can then be precisely adjusted before entering the reflow cycle, providing control during the entire process. The oven is capable of running six different reflow profiles per program, allowing it to efficiently reflow even multilayer and complex components. 112's patented assembly tool also offers great flexibility and control when handling sensitive components and fine-pitch chips. In addition, it has an optional closed loop air circulation asset, which ensures that any contamination that arises is quickly minimized. The oven also features a number of other special components such as a digital thermal controller and an exhaust model to ensure that heated air is not vented back into the surrounding area. HELLER 112 reflow oven is a robust and reliable machine that offers high-quality reflow of printed circuit boards in an efficient, cost-effective manner. Its comprehensive temperature control and vision equipment enables precise temperature control during the entire reflow process, while its patented assembly system and optional closed loop air circulation unit offer maximum control and flexibility when handling sensitive components.
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