Used HELLER 1700EXL #134015 for sale

HELLER 1700EXL Reflow Oven is a heavy-duty, high-performance oven used to solder and assemble printed circuit boards (PCBs). It is suitable for use in industrial, research and development, and prototyping applications. HELLER 1700 EXL Reflow Oven has a temperature range of 100°C to 300°C (212°F to 572°F), with a maximum temperature of 375°C (707°F). It offers an exceptionally uniform temperature profile, with an accuracy level of ±2°C (±3.6°F). The oven has an overall footprint of 2,025 mm (79.9") W x 690 mm (27.2") D x 1,755 mm (69.1") H. 1700EXL Reflow Oven has eight independently-controlled heating zones, ensuring precise control and optimum profile adherence. Each zone is independently programmed to suit various board configurations and uses either convection heating or infrared heating elements to achieve fast, even heating. The oven is capable of processing boards up to 1,600 mm (63") long and 305 mm (12") wide, and with a max PCB weight of up to 15 kg (33 lbs). 1700 EXL Reflow Oven features a state-of-the-art HMI touch-screen interface which allows users to easily program and initiate the reflow process. The oven has detailed management tools and diagnostics that allow for detailed analysis of reflow runs for greater process visibility and improved reflow performance. The system also allows for the programming of up to eight customized reflow recipes, which are then stored and accessible via the HMI. HELLER 1700EXL Reflow Oven is designed to reduce energy consumption while still providing high levels of performance and compliance with safety requirements. The warm-up time is fast, reducing the time to the desired temperature, and the convection and infrared heating elements are designed to quickly recover after door opening and closing. The oven also has a cleanroom-compatible filter system, which eliminates a majority of airborne particles while in operation. HELLER 1700 EXL Reflow Oven is suitable for a wide range of applications including high-frequency modules, low-heatsinks, aluminum-based boards, semiconductor devices, and sub-assemblies. Additionally, it is suitable for a variety of lead-free conformal coatings, such as water-based, acrylic, polyurethane and silicone-based materials. All-in-all, 1700EXL Reflow Oven is the perfect tool for achieving highly reliable and efficient PCB assembly.