Used HELLER 1700EXL #9196313 for sale

HELLER 1700EXL is an innovative reflow oven that is designed to deliver high-volume electronics assembly. It utilizes a series of nozzles to deliver hot air to the PCB components during the reflow process, ensuring even heating and improved solder quality. The oven includes a pre-heating chamber and several long zones to optimize temperature and solder quality.Hot air enters the pre-heating chamber and passes through the desoldering components before entering the main zones. This helps to evenly spread heat to the components and ensure a consistent reflow environment. In the primary heating zone, recirculated hot gas is provided by the nozzles in a series of multiple-level zones that run the length of the machine. This provides the necessary heat to complete the reflow process and ensure that there are no overheated or underheated areas of the board. HELLER 1700 EXL also features an off-gas zone where the fumes created during the reflow process are directed away from the electronics. For maximum process flexibility, 1700EXL features an intuitive control system that enables users to adjust the process parameters easily. The control system allows users to set the temperature of each zone, as well as schedule ramp up and cool down times for the entire reflow process. Additionally, the machine's touch-screen display and data logging features allow users to monitor the performance of the equipment in real-time. 1700 EXL is designed for improved process repeatability and ultimate process control, making it an ideal choice for high-volume electronics assembly. The combination of pre-heating chambers, uniform hot air flow, multiple zone-level peaks, and easy-to-use controls results in a high-quality reflow process. The machine is capable of handling boards up to 20 x 30 inches and has a temperature range from 50 to 300°C. HELLER 1700EXL is the perfect solution for manufacturers who require high-performance reflow ovens with maximum versatility.