Used HELLER 1700EXL #9363378 for sale

Manufacturer
HELLER
Model
1700EXL
ID: 9363378
Reflow oven PCB SMT With control PC.
HELLER 1700EXL Reflow Oven is a high-performance convection oven designed for a wide range of electronics and consumer product assembly operations. It features a temperature profile with up to 6 zones of heating, pre-programmed temperature profiles, and full profiling capabilities. The oven also features adjustable ramp and peak dwell times, allowing users to precisely control their solder reflow process. HELLER 1700 EXL is capable of temperatures up to 450°C (842°F) and offers a wide range of conduction and convection heating options. The advanced digital profile is configured through separate intelligent controllers for each zone and supports up to four programmable profile channels. Each channel can be configured with up to 50 profile segments, and each segment can be configured with up to four variables, such as preheat temperature, peak temperature, time at peak temperature, cooling rate, and post-profile steps. The oven's temperature profile is based on a series of heating and cooling elements along the convection heating path. This ensures that the entire surface of the PCB is evenly heated during the soldering process. The compact chamber design promotes efficient transfer of thermal energy, allowing for rapid, uniform heating. With a forced convection system the heat is distributed evenly across the PCB, providing excellent heat flux consistency and a uniform solder joint formation. 1700EXL comes with on-board configurable input/output (I/O) and specific safety interlocks to ensure safe operation. The oven is built with a rugged outer casing and a stainless steel chamber, making it extremely durable and reliable. Its intuitive graphical user interface (GUI) allows for effortless setup of operation, and the included software packages enable remote monitoring and scheduled operation. 1700 EXL Reflow Oven is an important tool for precise control in electronics and consumer product assembly operations. It offers repeatable and reliable reflow soldering process with a temperature profile up to 450°C, pre-programmed profiles, adjustable ramp and peak dwell time, advanced digital profile configuration, and a robust stainless steel chamber. With all these features it is an integral tool for any electronics or consumer product assembly process.
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