Used HELLER 1706 EXLN #9256300 for sale

HELLER 1706 EXLN Reflow Oven is the perfect solution for production of printed circuit boards and other surface mount devices requiring reflow soldering. It features a unique infra-red hot zone and forced convection cooling section which ensure consistent temperature profiles over all board sizes and parts, providing repeatable results and reliability. The oven has a modular structure with 18 heating zones along with four convection fans and two IR thermopiles. Its 5" touch screen panel enables access to 110 pre-programmed recipes, offering ultimate flexibility and convenience in terms of temperature reporting, alarm setting, cycle programming, and manual adjustment of timer settings. The advanced cooling control and heat recovery capability enable precise thermal control, and the powerful tracking function ensures safety and accuracy for even the most complicated cycle profiles. The unit is built with an efficient double pane construction featuring a low thermal mass steel/aluminum construction and an exterior cladding of stainless steel ensuring durability and integrity during high temperature processes. The infrared and convection sections are powered by separate drive controls for greater power efficiency, and the box-type construction promotes a faster cooling time and improved uniformity. The oven also supports advanced networking capabilities allowing the user to control multiple ovens in different locations simultaneously, monitor the cooling profiles of up to eight ovens, and enable efficient temperature profiling over multiple sample panels. All the parameters are logged and profiles can be saved, recalled and evaluated. In addition, it is equipped with an intuitive graphical user interface providing easy user operation and optimal functionality. Finally, 1706 EXLN Reflow Oven meets or exceeds all industry standards for reflow oven safety and containment, with an explosion-proof construction and exhaust requirements compliant with Rotruck and C.E. test standards. With its efficient construction, easy operation and advanced networking capabilities, HELLER 1706 EXLN Reflow Oven is the ideal solution for reliable and repeatable surface mount device and printed circuit boards production.