Used HELLER 1800EXL #9063435 for sale

HELLER 1800EXL Reflow Oven is an affordable, high-performance platform designed for supporting production throughput in the flexible manufacturing of lead-free soldering applications with medium to high-volume requirements. HELLER 1800 EXL provides a flexible process flow to improve precision of the reflow process, up to 30% higher throughput than other reflow solutions on the market. 1800EXL is constructed with four independent convection zones and a semi-automated bottom preheat/soak zone for greater control of the board and temperature profiling. The heating elements are insulated with thermal barriers to reduce air leakage and minimize overall warmup time. Ii also has dual redundant CIP design, servo-driven belt conveyor for x/y/z table adjustment, and a multi-level configurable process control software. 1800 EXL features an advanced Fuzzy Logic Control Equipment which ensures accurate thermal control. This system utilizes AI algorithms to scan the temperature and automatically adjust the time and temperature according to the different size PCBs. It also features an overshoot (OTSS) control unit that monitors the overall temperature of the reflow oven (not just the parts under reflow) and gives an accurate plan for a complete, flawless rework process. HELLER 1800EXL has a user-friendly color touch screen interface that can store up to 16 available profiles in its memory. Each profile may have its own parameters such as zones top temperatures, zones time settings, PCB number, number of boards, belt speed etc. This makes the setup for the device flexible and easy. Additionally, it is equipped with SMEMA communications for interfacing with other devices. HELLER 1800 EXL is designed for use in production environments with safety features such as locked covers, infrared temperature sensors and anti-overheating fixed doors. Maintenance of the oven is made easier with its built-in air filter machine, low noise and total energy consumption. Overall, 1800EXL Reflow Oven is a great choice for all electronic assembly needs as it offers superior precision of the reflow process along with the flexibility of parameters and reliable safety features. It is the ideal choice for medium to high-volume production of lead-free soldering applications.