Used HELLER 1808-MK V #9191324 for sale

HELLER 1808-MK V
Manufacturer
HELLER
Model
1808-MK V
ID: 9191324
Vintage: 2014
Reflow oven 2014 vintage.
HELLER 1808-MK V reflow oven is a state-of-the-art commercial heating and drying system. It utilizes a combination of convection, infrared, and translation heating methods, all of which have been tailored to achieve the desired results for various types of solder and components. The oven features a shuttling conveyor system, allowing precise baking cycles to be created and duplicated according to user specifications. The convection heating method creates a consistent temperature profile across the entire product board, while the infrared heating can narrow a gap or heat an individual component quickly. The shuttle-based process maintains consistently uniform temperatures and consistent air flow throughout the chamber. This helps promote even bonding of the solder and components to the PCB. 1808-MK V features digital touch-screen control, allowing for custom recipes with multiple heating/cooling zones. Each zone can be customized according to its application and components, providing repeatable and reliable results. The oven chamber measures 1700mm x 1100mm x 500mm and is insulated with stainless steel. The maximum heating temperature is 350°C. It utilizes PID temperature controllers with auto-tuning, ensuring temperature accuracy within ±1°C throughout the oven. HELLER 1808-MK V uses forced convection fans with variable speed adjustment to help maintain even airflow and temperature uniformity. The oven design also allows the operator to work in the Bake and Reflow zones separately, controlling the temperature for each section. This is ideal for larger board products, where higher temperatures are needed for the Reflow zone but not for the Bake zones. The precision control and operator interfaces also ensure efficient and repeatable processes, as well as safety features for the operator. Overall, 1808-MK V reflow oven from HELLER is a reliable and robust solution to help ensure reliable bonding of solders and components to the PCB. Its digital control, temperature uniformity, and precision control are all suited to a range of applications with minimal maintenance and maximum life expectancy.
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