Used HELLER 1808EXL #9071655 for sale

HELLER 1808EXL Reflow Oven is an advanced thermal processing platform that is designed to provide reliable operation during the manufacturing process of soldered products, such as circuit boards, electronics components, and cell phone cases. This reflow oven features a full profile color touch screen that allows for easy navigation and control of individual reflow processes. 1808EXL also includes an automated chamber-pressure/temperature controller, uniform air heating, air cooling, and zone isolation capabilities that help ensure repeatable results for every thermal process. The oven is equipped with an 8" wide, 320mm by 250mm high, internal reflow chamber which is capable of handling up to 250mm board sizes. This chamber can accommodate up to 15 plates or 25 boards with bases, and offers excellent temperature uniformity when equipped with a custom built heated air circulation system. On board HELLER 1808EXL is precision temperature profiles that can be programmed to match process requirements. The temperature profiles can be configured in 4 segments, allowing temperatures that can be controlled from 100C to 310C. This full range of temperatures enables users to perform any kind of assembly process with ease. 1808EXL also includes advanced control features such as a ramp rate regulator, pre-bake and post bake capabilities, and gas profiling. Ramp rate regulator can be used to reduce temperature quickly from the preheat zone to the reflow zone and then raise temperatures gradually with time, ensuring a controlled and accurate process. The pre-bake helps to reduce water absorption before reflow and the post-bake capability is necessary for maintaining an optimal reflow temperature for maximum solder wetting. Furthermore, HELLER 1808EXL has a built-in gas profiling feature to control the atmosphere during the reflow process. This allows users to modify the nitrogen and oxygen levels or add other gasses for different application requirements. 1808EXL is the perfect solution for many production line operations. Its advanced controls, temperature uniformity, adjustable temperature profiles, and customizable gas profile make it ideal for a variety of soldering applications. Highly adaptable and dependable, HELLER 1808EXL reflow oven provides reliable performance, allowing users to maximize yields and speed up their production processes.