Used HELLER 1809 MKIII #293604698 for sale

HELLER 1809 MKIII is a reflow oven designed for precise control of the soldering process in surface mount technology (SMT) projects. This reflow oven is designed to bake electronic components and assemblies at precise temperatures. This is an energy efficient reflow oven that can heat up large PCBs in a very short amount of time. It offers precision temperature control and temperature monitoring, quick and efficient soldering, and a high quality PCB repair capability. HELLER 1809 MK III features a large oven chamber which has two independent temperature and process zones. This ensures accuracy during the baking process and allows for separate parameters for the board and components. The oven chamber consists of high-efficiency quartz heating elements and two independent top heated conveyors with independently adjustable speeds and a high temperature safety system. The timed, precise and unlimited thermal ramp profile can be configured with nice steps, allowing the dwell time for different temperature levels, and the main function of this process is to avoid any deformation of the components, boards, and solders. The heating speed of this reflow oven can be adjusted from 10cm/s to 5m/s. This can help prevent air time damage to the board and/or components. 1809 MKIII features a powerful cooling fan that controls the cooling rate of the board, which is adjustable from 1°C/s to 10°C/s. This helps to prevent thermal shock which can cause oxidation and possible internal damage. This reflow oven also features a wide range of process parameters including solder paste melting temperature (SMT), curing time, top side temperature range, and conveyor speed settings. Additionally, various additional sensors such as infrared, thermocouples and the photoelectric can help with precision control. Overall, 1809 MK III offers an excellent choice for SMT production and is a highly accurate, energy-efficient reflow oven with excellent PCB repair capabilities.