Used HELLER 1809 MKIII #293647116 for sale

Manufacturer
HELLER
Model
1809 MKIII
ID: 293647116
Vintage: 2012
Reflow oven 2012 vintage.
HELLER 1809 MKIII is a convection-type reflow oven that provides an efficient and precise baking solution for printed circuit board (PCB) assembly. The reflow oven is suitable for producing single and double-sided PCBs with SMT, BGA and leadless devices of up to 500 mm x 400 mm in size. The oven features high temperature accuracy and can reach temperatures up to 300°C (572°F). HELLER 1809 MK III features precise temperature control, high-resolution temperature sensors and advanced software for unprecedented accuracy and repeatability. The oven contains two independent, programmable temperature zones and two convection heating systems to ensure uniform heating. This reflow oven includes separate control systems for each zone, as well as precise PID controllers for precise control of preheat, soak and reflow temperatures. 1809 MKIII is equipped with a user-friendly touch screen interface, an intuitive workflow and complete traceability. The oven is capable of storing up to eight reflow profiles, and it allows users to conveniently program temperature profiles according to the solder paste and components used. It also features dynamic profiling, which monitors and adjusts the temperature profile throughout the reflow cycle in order to optimize the overall process. The advanced thermal recovery technologies of 1809 MK III enable rapid reflow cycles with reduced energy usage compared to standard professional reflow systems. The oven is equipped with an advanced cooling system that works quickly and quietly, allowing to cool the printed circuit board within seconds after the reflow cycle. It also features an air-tight construction, which reduces oxidation in the oven and increases overall efficiency. In conclusion, HELLER 1809 MKIII is an efficient and precise reflow oven, ideal for producing single and double-sided PCBs with SMT, BGA and leadless devices. Its advanced thermal recovery technologies allow for fast and optimal reflow cycles, and its user-friendly interface and complete traceability make this an excellent choice for PCB manufacturing.
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