Used HELLER 1809 MKIII #293769581 for sale
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ID: 293769581
Vintage: 2010
Reflow oven
Stencil cleaner
Magnetic tooling pin
PCB Thickness: 0.2 - 6 mm
Substrate weight: 0-1 kg
Camera:
198040 DEK Graphite camera
198041 DEK CBA40 Green
198042 DEK Gold
198043 DEK Hawkeye
Frequency: 50 V - 60 V
Power supply: 110 V - 220 V
2010 vintage.
HELLER 1809 MKIII is a reflow oven designed to quickly and uniformly heat electronic components. This allows them to be soldered and assembled without the need for manual soldering. HELLER 1809 MK III is capable of performing a variety of thermal profiles, from quick heat-ups to complex ones with multiple phases. Its convection heating equipment ensures uniform heat distribution and faster temperature ramp-up times. The device consists of two primary parts: a main cabinet and a smaller oven mounted on it. The main cabinet houses the main circuit boards and the LCD control panel, while the oven includes two heating zones with independent temperature controls. The temperature control system is highly precise, with a repeatability rate of ±5°C. The maximum heat output of 1809 MKIII is 450°C, with a peak temperature of 600°C during reflow. It has a maximum throughput of 161 units per hour, with a maximum throughput of 57 units per hour when using the larger heating zones. Its generous chamber size allows it to accommodate boards as large as 450x535x50 mm in size. 1809 MK III is highly efficient and easy to use. Its multi-functional control panel displays all the necessary data to start a reflow cycle, including current/target temperature, part and conveyor speeds. It also has an intuitive user interface that allows users to customize their profiles for a particular job. The device comes with an integrated fan unit that circulates air within the oven to keep temperatures consistent even at the highest speeds. It has a durable external construction, rated to IP21 standards for protection from dust and moisture. HELLER 1809 MKIII is an ideal choice for both small- and large-scale electronic production operations. Its efficient design and easy-to-use features make it an ideal choice for handling the most demanding electronic assembly jobs. Its temperature accuracy and consistent heating make it suitable for a wide range of components and boards. Furthermore, its robust construction and efficient air-flow machine make it a reliable choice sure to reduce the time and effort required for the most sensitive reflow processes.
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