Used HELLER 1809 MKIII #293814464 for sale

Manufacturer
HELLER
Model
1809 MKIII
ID: 293814464
Vintage: 2017
Reflow oven 2017 vintage.
HELLER 1809 MKIII is a high-precision reflow oven designed to provide reliable and precise reflow of solder paste and attachments on printed circuit boards (PCBs). Utilizing its flex programmable and automated functionality, it enables process consistency and repeatability. The unit features 9 heating zones with independent temperature control and a top cooling zone. It also offers adjustable preheat plate and soft start function; independent heat zone power configuration; as well as on-screen profiling capabilities. The unit is equipped with two independent heating areas, over and below the conveyor. This is necessary in order to achieve a precise temperature waveform distribution. A central management system and graphical display is provided, allowing users to store up to 16 different reflow profiles and to program up to 10 production set-ups. With its boosted heater power, the model is capable of achieving reflow temperatures up to 400 °C in just under two minutes, with a maximum controlled temperature of 280 °C. The interior size of this type of oven is 18*09". It also features an optional nitrogen capability for soldering lead-free applications and includes subtle, ceramic tiled insulation for improved safety. The metal outer shell is designed to protect the system from external shocks or damage and includes full-length, hinged-access doors for convenience. With durable and efficient components, this reflow oven also offers reliable performance with low energy consumption, assisting users in achieving maximum profitability and quality. The unit's control system is both integrated and user-friendly, enabling easy access to daily statistics, as well as software upgrades. Configurable alarm levels, production recipes, recipes, curves, and other intricate control management options can easily be adjusted from the display. In addition, H1809 MKIII reflow oven can be further customized to suit specific manufacturing needs, such as soldering lead-free applications, achieving controlled temperature and repeatability, preventing over and under soldering and saving energy.
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