Used HELLER 1809 MKIII #293817553 for sale

HELLER 1809 MKIII is an advanced reflow oven designed for lead-free soldering operations. It is capable of complete reflow processing using many different types of solder pastes, including high temperature, lead-free and low temperature lead-free solders. Its reflow chamber can accommodate a wide variety of board sizes up to 450 x 600mm. HELLER 1809 MK III features a revolutionary air equipment which is designed to keep the temperature of the reflow chamber evenly distributed across the board. A patented vertical hot air distribution system can precisely control the speed of air circulation in the chamber, reducing the turbulence of the atmosphere. This air unit is designed to use direct or indirect air circulation with a maximum temperature of 280°C and a minimum temperature of 180°C. The reflow heating is achieved by a combination of infrared and convection heating, providing increased precision and uniformity in temperatures. To ensure production consistency, 1809 MKIII is equipped with an integrated profiling machine which is capable of continuously recording all temperature data and calculating the average temperature values. This allows precise temperature profiles to be easily created and saved, ensuring maximum product reliability. The monitoring tool also allows the operator to activate various alarms within the oven chamber for temperature, flow and time monitoring. 1809 MK III is designed to provide uniform processing results with a minimum of manual intervention and adjustment. The machine has an LCD display with a touchpad interface for easy operation, and a number of detailed settings are available for fine-tuning the reflow process. An optional programmable program function allows for up to sixteen recipes to be saved and repeated with one button touch. Additionally, a cooling section is included to provide fast, reliable cooling which is critical for avoiding card damage. Overall, HELLER 1809 MKIII is an advanced reflow oven solution for lead-free soldering processes, providing improved asset control, repeatability and greater efficiency. Its precision heating options, integrated profiling model and touchpad operation, make it an ideal choice for a wide range of demand requirements.