Used HELLER 1809 MKIII #9167267 for sale

HELLER 1809 MKIII Reflow Oven is an industrial-grade solder reflow oven designed to meet the most stringent requirements of the electronics manufacturing industry. It is a multi-zone, top-down oven that utilizes convection heating technology and superior airflow to provide consistent and uniform heating throughout the oven chamber. HELLER 1809 MK III can accommodate a wide range of device sizes, from small QFNs and CSPs, up to large and complex PCBs. The oven is equipped with a full touchscreen touch interface which gives the user complete control over the reflow process. The interface offers a variety of heating and cooling curves which can be customized and optimized for each product or batch. The oven also features near-infrared heating for precise temperature control, as well as an automatic cooling system to ensure optimal temperature stability. The oven is designed for easy operation and maintenance, with features like a removable top cover, slide-out rack, and an easy-access service panel. The automated cleaning system helps to ensure reliable and efficient operation by removing any solder tails from the oven chamber, as well as preventing solder residues from accumulating. The oven also includes safety interlocks to protect personnel and equipment in the event of any malfunction. The oven is capable of operating at temperatures up to 450°C and has a maximum throughput rate of 15,000 pieces per hour, making it ideal for high-volume production requirements. It is a robust, powerful and reliable machine, designed for reliable and consistent operation for extended periods of time. Overall, 1809 MKIII is an excellent choice for any production environment, with the advanced features and reliable performance ensuring a smooth and efficient reflow process. With its flexible, user-friendly interface and high throughput rate, 1809 MK III is an ideal solution for any electronics manufacturer.