Used HELLER 1809 MKIII #9172851 for sale

HELLER 1809 MKIII
Manufacturer
HELLER
Model
1809 MKIII
ID: 9172851
Vintage: 2009
Reflow oven (9) Zones Mesh belt No center support Edge rail PCB Flow: Right to left Counter: Around 30 ~ 32K hours Power: 480 Volts 2009 vintage.
HELLER 1809 MKIII Reflow Oven is a high-performance soldering equipment designed for the rapid and efficient production of printed circuit board assemblies. It provides an economical alternative to traditional wave soldering and combustion-based soldering systems. This oven is designed to produce high-quality solders with consistent heating, uniform thermal profiles, and a stable process. The machine's primary purpose is to provide an efficient and effective way to provide higher quality soldering in a faster production environment. With its high-end precision controls, it can maintain an even heat flow as it works to cause solder to flow smoothly and without burning of components, ensuring a reliable product. It has an energy feedback system with multiple power levels and pulse heating capabilities to ensure accurate, repeatable thermal profiles. This helps to provide a stable solder flow and uniform results. The equipment has an electric fan-forced convection feature to evenly distribute heat throughout the chamber. This prevents hot and cold spots within the oven, making it especially suitable for surface mount technology. It also includes a Built-in PID temperature controller and temperature feedback for accurate process control. Additionally, it has an auto power reset to prevent damage caused by inadequate cooling. The machine is capable of temperatures up to 300°C, making it ideal for lead-free and lead based solders. It has an adjustable conveyor speed and a unique wide temperature range preheat zone for adapting to challenging assembly layouts. The conveyor is designed to allow for a wide range of components and board sizes to be processed. The unit also includes an NMX-2 text display to provide a visual view of all data during the soldering process. HELLER 1809 MK III is compliant with the latest international safety standards and features an air injection unit to ensure a safe and clean operating environment. It is also well-suited for bottom side soldering applications such as through-hole and partial surface mount components. 1809 MKIII Reflow Oven is perfect for manufacturers that need a high-performance yet economical soldering machine. With its multiple power levels, pulse heaters, and uniform thermal profiles, it is designed to provide efficient and stress-free production of printed circuit board assemblies.
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