Used HELLER 1809 MKIII #9352585 for sale

HELLER 1809 MKIII Reflow Oven is a reliable, high performance equipment designed to meet the needs of semiconductor manufacturers. This reflow oven offers a fully automated reflow process with low emissions, high thermal accuracy, and a superior temperature profile. The oven utilizes a patent-pending Hot Air Pulsing system to precisely control the flow of air throughout the oven without compromising quality or thermal accuracy. HELLER 1809 MK III is capable of processing up to 28 PCBs at one time, allowing for large volume production without sacrificing quality. Its modular design permits companies to expand their production to meet demand. It also allows for quick and easy changeover between different PCBs. The oven is equipped with a touchscreen HMI for easy operation and data logging. The oven's heated chamber contains six independently adjustable horizontal heads, which reduce operational costs by eliminating the need for human labor. These heads precisely control the flow of air and process temperature, allowing for superior thermal accuracy, uniform board-to-board consistency and maximum process repeatability. 1809 MKIII also features a Pulsar Heater Management Unit, a new feature that allows for multiple independent and evenly distributed heaters inside the heated chamber. This optimizes thermal uniformity in the oven and provides increased flexibility for managing peak temperatures for specific products, which leads to exceptional component quality. The oven is designed to be energy efficient and is compliant with RoHS and REACH directives. The temperature control machine utilizes PID closed-loop tool which helps to reduce energy consumption and ensures process stability. The oven incorporates oven chamber insulation to reduce temperature leakage, resulting in a low thermal load, while also utilizing LED lighting to reduce electrical energy consumption. 1809 MK III Reflow Oven is one of the premier systems on the market and is ideal for meeting the production and process demands of modern semiconductor manufacturers. End-users can expect superior component quality, improved manufacturing flexibility, and reliable efficient operation with this asset.