Used HELLER 1809 MKIII #9411344 for sale

HELLER 1809 MKIII is a reflow oven designed to melt and join components to printed circuit boards using melted solder paste. It is ideal for medium to high-volume production environments, providing a reliable and efficient production process. It is also suitable for medium-orbit or forced convection applications. The unit has an integrated integrated infrared/thermal layer control that allows precise temperature regulation of the PCB and components during the reflow process. The temperature is adjustable from room temperature to 350°C and can be regulated with the four heating zones that can be adjusted independently. This ensures precise heat distribution across the oven for even and uniform heat. The oven also has a SMD-BGA heating nozzle designed for fast and efficient paste layer melting. With its rapid heating speed, it can easily handle high-volume production and apply heavy doses of solder paste to larger, more complex PCBs. The nozzle can also be used for specialized applications such as preheating, rework, and SMT industry. Thanks to the menu-driven LCD, the system can be customized to the users' requirements, including process parameters, test programs and production recipes. The stored programs and recipes can be recalled at any time to ensure accurate and consistent process results. HELLER 1809 MK III is a state-of-the-art reflow oven that provides a reliable, consistent and efficient production process. Its robust construction and reliable calibration ensure repeatable and reliable results, making it ideal for medium to high-volume production work. With its intuitive and straightforward operation, it is easily operated by even the most novice user, allowing for quick start-up and less downtime.