Used HELLER 1809EXL-N2 #293615213 for sale

HELLER 1809EXL-N2 is a precision reflow oven designed for lead-free soldering applications. This reflow oven utilizes an infrared heating equipment to provide superior, uniform solder reflow with process repeatability and reliability. With its compact design and high performance, 1809EXL-N2 is the perfect choice for high-volume production and prototyping. HELLER 1809EXL-N2 utilizes a patented smart profiling process, which accurately and more quickly heats and cools, for improved solder output. It is equipped with six independently adjustable zones, each capable of heating up to 400˚C. The temperature of each zone can be monitored for greater control during the reflow process. The heated air is directed onto the printed circuit boards (PCBs) at a reduced velocity, allowing uniform heating across the board. The air volume can also be adjusted to suit the board requirements. An additional feature of 1809EXL-N2 is its advanced cooling cycle. This high-velocity cooling system prevents hot spots on the PCB and helps ensure a reliable solder joint. The unit is designed to maintain a steady, uniform temperature profile over time, helping to reduce thermal shock effects. Safety is also a key function of HELLER 1809EXL-N2. The equipment is equipped with a self-test feature, which scans each zone for temperature accuracy prior to use. Additionally, an automatic shutoff machine kicks in when it detects that temperatures are outside the set parameters. 1809EXL-N2 is designed with the latest technologies and processes to provide the utmost in solder reflow reliability. It is capable of quickly and accurately reflowing a wide variety of solder paste types, including both lead and lead-free, with uniform temperature profiles across the entire board. HELLER 1809EXL-N2 offers excellent process control, repeatability and consistency, making it a great choice for complicated, high-volume board production.