Used HELLER 1809EXL #293641883 for sale

HELLER 1809EXL Reflow Oven is a professional-grade reflow oven designed for the production of printed circuit boards. It is suitable for use in industrial and commercial applications alike, and is capable of executing reflow soldering, wave soldering, and solder baking processes. HELLER 1809 EXL Reflow Oven offers a unique combination of fast automatic pre-heat, advanced IR and convection heating, precise soldering profiles and advanced airflow dynamics, resulting in highly efficient and repeatable soldering processes. The fully automated equipment controller utilizes a PID algorithm to regulate temperatures with superior accuracy and repeatability. 1809EXL is equipped with an infrared convection heating system that ensures accurate, precise and repeatable soldering temperatures. An adjustable air knife unit provides precise air pressure control, which is adjustable to ensure the best air pressure settings for different products to ensure quality soldering. The overhead IR heater allows for precise soldering temperature control, resulting in improved board-level wetting and solder joint quality. Other features of 1809 EXL include a robust design that ensures durability under the most arduous conditions, as well as heated and closed door sensors. The integrated cooling machine allows for the fastest possible cooling of soldered PCBs, which helps to ensure the quality of solder joints. The tool also offers an optional EMXI-5 construction management asset, which provides complete control over the management and monitoring of the production process. HELLER 1809EXL is available in three different models, each of which offers a number of different functions. The lowest level offering, HELLER 1809 EXL-1, features 12 profiles, 250mm x 350mm board size, two-zone forced convection heating and single wave soldering capabilities. 1809EXL-2 version upgrades to 15 profiles, 400mm x 600mm board size, three-zone convection heating and dual wave soldering. The top of the line model, 1809 EXL-3, offers 20 profiles, 400mm x 600mm board size, three-zone IR/convection heating, and dual wave and reflow soldering capabilities. In summary, HELLER 1809EXL Reflow Oven is an advanced professional-grade reflow oven that offers precise soldering profiles and efficient airflow dynamics, resulting in highly repeatable soldering process. The model is fully automated and offers a comprehensive construction management equipment for comprehensive control of the production process.