Used HELLER 1809EXL #293765851 for sale

HELLER 1809EXL is an advanced air reflow oven designed for low-medium volume, high accuracy PCB assembly. HELLER 1809 EXL is ideal for assemblies that require precise temperature control such as aluminum and other thermally conductive substrates. The oven operates with a forced convection system that evenly distributes heated air throughout the reflow chamber. It is equipped with two top-mounted heaters that deliver programmable heating rates based on type of assembly and type of PCB material with as much as 3,100W of power across the heating zone. The oven's programming capabilities let you fully customize the reflow profile to meet all your specific process needs. Temperature is accurately set and monitored through a integral thermal controller with temperature ranges from 50°C to 350°C. The temperature can be accurately monitored on a digital display using 0.1°C increments. Additionally, 1809EXL is equipped with an advanced airflow system and independent fan speed controls. The convection fans in the oven circulate heated air throughout the reflow chamber for maximum temperature accuracy and process repeatability. The fixed air nozzles located on the top, middle and bottom ensure a homogeneous air flow distribution and heat transfer. 1809 EXL features an ultra-wide opening door for improved visibility and easy access during setup and operation. The door also reduces product handling time and eliminates mechanical damage to components due to manual handling. The oven also benefits from an adjustable tray carrier system that allows workspace and component placement to be adjusted to the customer's desires. In addition, HELLER 1809EXL is equipped with a variety of safety features, such as a built-in temperature overload protection that protects the product from being damaged by over-processing. The machine can also be linked up to a central PC for monitoring and documentation of all process operations. HELLER 1809 EXL is a robust and reliable reflow oven and is a suitable option for low-medium volume, high accuracy PCB assembly.