Used HELLER 1809EXL #9132368 for sale
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ID: 9132368
Vintage: 2010
Reflow oven,
Air type
L-R-Front
Chain & center board support
2010 vintage.
HELLER 1809EXL is a popular reflow oven used for soldering electronic components onto printed circuit boards (PCBs). It features a 480x500 mm working area with a maximum temperature of 300°C, allowing for a wide range of manufacturing processes. The oven's heating elements consist of a single-zone radiant equipment, which provides accurate and consistent reflow temperatures for even the most complex surface mount and through-hole technology designs. This is combined with a patented wave-soft system, which helps to reduce component damage due to excessive heating. To further enhance the reliability of the reflow process, the oven also features PID, or proportional integral derivative, temperature control. This provides continuous feedback during the heating process to help maintain precise temperatures. HELLER 1809 EXL also provides the added flexibility of programmable profiles, helping to Customize the reflow process to users' specific requirements. It also has an LCD touch screen display, which allows specific modes and temperatures to be set quickly and easily without the need for any additional programming. The oven is equipped with an efficient preheating unit, designed to ensure that components reach their ideal temperature as quickly as possible while also conserving energy. With a rapid heating and cooling time, it can complete a standard reflow cycle in as little as three minutes, and the four-layer oven rack machine allows for simultaneous flow soldering of multiple PCBs. An advanced recovery tool is also included to minimize the time spent between batches, giving 1809EXL an added layer of efficiency even during heavier workloads. Lastly, a durable stainless steel construction further adds to the oven's reliability and lifespan. Overall, 1809 EXL is a reliable and user-friendly product, designed to deliver efficient reflow soldering results. Its range of features make it well suited for both prototyping and production runs of surface mount and through-hole components.
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