Used HELLER 1809EXL #9155896 for sale

HELLER 1809EXL reflow oven is a state of the art electronic soldering solution that provides for the precision reflow of solder tools. This equipment utilizes a rapid and consistent electronic heating system that is capable of evenly and accurately heating up to 40 mm (1.57 inches) panels. The oven is designed with advanced technologies that provide a temperature accuracy of ±1.5°C. It utilizes Automatic Temperature Profiling (ATP) that cycles the heating elements of the oven in order to deliver desired temperatures throughout the entire heating cycle. Additionally, the unit automatically adjusts the heaters' settings during the reflow process so that solder joints are consistently reflowed at the highest level of efficiency and process consistency. The oven also features a programmable touch-screen interface that allows operators to easily control the reflow process and set the exact temperature and process duration they require. The user-friendly interface also makes it easy to store, browse, and export thermal profiling data for analyzing reflow profiles from the production line to the quality assurance department. This feature allows users to read and accurately analyze reflow profiles to quickly determine if processes are within specifications. The energy efficient HELLER 1809 EXL is also equipped with advanced safety features, including an electromagnetic field emission protection machine. This tool protects both the operators and the components, providing a safe environment. Additionally, the oven offers energy saving options, allowing users to adjust the parameters of the oven to reduce power consumption and save costs. As a top-of-the-line solution, 1809EXL reflow oven offers the latest advanced technologies, ensuring your electronic parts are soldered with a precision fit. With the advanced temperature accuracy, automated profiling tools, user-friendly interface, safety features, and energy-saving options, this asset is sure to live up to the highest standards of quality and performance.