Used HELLER 1809EXL #9299016 for sale

HELLER 1809EXL
Manufacturer
HELLER
Model
1809EXL
ID: 9299016
Wafer Size: 6"
Reflow oven, 6".
HELLER 1809EXL is a state-of-the-art reflow oven used for the automated assembly of through-hole, surface-mount, and mixed technology printed circuit boards. The oven features a travel length of 900mm, adjustable infrared top and bottom heat, liquid cooling, static forced-air cooling, and steam cooling. With temperature values adjustable from ambient to +300°C, the oven is suitable for the most demanding reflow processes. The infrared heating equipment on HELLER 1809 EXL is adjustable, allowing technology developers to customize their production line for the desired application, while preserving the quality and reliability of the reflow process. The temperature control system features dual thermocouple controls, utilizing a high-precision PID algorithm with adaptive control parameters which can be easily adjusted to optimize production process parameters. The temperature resolution is up to 0.1°C and temperature accuracy is ±1°C. 1809EXL's forced-air convection unit utilizes an axial fan to distribute the heated air throughout the entire oven chamber, ensuring an even temperature distribution from top to bottom. The static convection function also allows a uniform temperature across the entire workpiece. The liquid cooling machine uses water and waste heat energy to cool the board after reflow, ensuring that the board remains at a safe temperature before it is ejected from the oven. Furthermore, a powerful steam cooling module is available to reduce the temperature of the board to a comfortable level after reflow. Safety features such as alarms, door locks, air-flow sensors, and motion detectors assist in the protection of personnel and equipment from dangerous situations. The error protection function can be enabled when all the temperatures, thresholds, and profiles have been set, automatically stopping the oven in the event of cooling problems or temperature irregularities. 1809 EXL comes with one of the most reliable and advanced interfaces on the market. All parameters can be easily adjusted on the large LCD touchscreen and the advanced software allows for good monitoring and control over the process. The oven can be connected to a PC or network for data logging, to allow for total traceability. The interface also allows for remote control, allowing for easy monitoring and control of the reflow oven over a network or Wireless connection. HELLER 1809EXL is an ideal reflow oven for the automated mass production of PCBs. With its reliable performance, advanced features, and user-friendly interface, HELLER 1809 EXL is the perfect solution for modern reflow operations.
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