Used HELLER 1913 MK III #293792638 for sale

HELLER 1913 MK III Reflow Oven is a high-performance reflow oven used for soldering components to Printed Circuit Boards (PCBs). This fully automated reflow oven is designed to provide consistent and reliable results for high-volume production processes. HELLER 1913MKIII includes a number of advanced features that enable it to process a wide array of PCBs. It comes with a controllable conveyor speed, enabling the oven to process larger PCBs at faster speeds. Additionally, the unit is designed to support zones with different speeds, allowing for precision control over the reflow process. This oven also features a variable conveyor width, enabling it to handle a wide range of PCBs. The heating element of 1913 MKIII has a high temperature range, allowing it to reach temperatures up to 330 °C. This allows it to accommodate lead-free solder paste, allowing it to meet the lead-free requirements of today's electronics industry. The equipment comes with a ceramic infrared heater that offers fast thermal recovery and superior temperature control. 1913 MK III is equipped with a large LCD touch screen display that provides an intuitive user interface for monitoring the reflow process. This system also includes a data logging and analysis feature to measure temperature changes and other variables throughout the reflow cycle. The oven also includes a line stop feature which can be used to stop the conveyor in the event of a fault. This feature allows for quick and easy rectification for any issues that arise during the production cycle. HELLER 1913 MKIII also has an inbuilt airflow unit designed to optimize and control the flow of air over the boards. The machine comes with adjustable fan speeds that can be set and controlled to ensure even heating of the board during the reflow process. Overall, 1913MKIII is an efficient, reliable and cost effective reflow oven solution. It is designed to provide users with consistent and reliable results during the production process. This unit offers fast thermal recovery, superior temperature control and adjustable airflows, making it a great choice for high volume PCB production processes.