Used SMT 400C #9276603 for sale
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SMT 400C is an industrial grade reflow oven designed for the mounting of surface-mount technology (SMT) components. Featuring an insulated, horizontally configured, four zone chamber, 400C is capable of handling a wide variety of SMT component sizes and will accommodate up to 12" wide, 30" deep and 10" tall board assemblies. The oven has a total of sixteen temperature zones (12 top and 4 bottom) with a temperature control range between 50°C (122°F) and 400°C (752°F). These zones are evenly distributed throughout the chamber to provide consistent heat and temperature uniformity. The oven includes a fan-driven cooling system, which delivers cooled air through the chamber to reduce the reflow time and also aid in preventing thermal shock from affecting boards. SMT 400C utilizes convection heat transfer to evenly circulate the hot air during process and minimize thermal shock. 400C is also designed with on-screen programming capabilities that allow users to quickly and easily configure the options and parameters for a given SMT board assembly. Key settings include zone temperatures, conveyor speeds, preheat soak times, peak temperature, cool-down processes, and nitrogen supply settings. Additionally, the oven's touch-screen interface includes built-in diagnostics and maintenance tracking features to help optimize overall productivity, efficiency, and performance. In addition to its core features, SMT 400C's innovative design includes an integrated smoke filtration unit with two activated charcoal filters, an integrated data logging system, and a data communication port to store process and maintenance data. This feature allows users to monitor changes in process values and oven performance over time. 400C is designed for optimal reliability and is constructed for industrial-grade use in both 24 VDC and 220/240 VAC environments. With its rugged construction and advanced temperature control technology, SMT 400C is one of the best in its class and provides a powerful platform for reliable and repeatable board reflow processes.
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