Used SMT F6 #9233901 for sale

Manufacturer
SMT
Model
F6
ID: 9233901
Vintage: 2014
Reflow oven Mesh belt conveyor (12) Heating zones: (6) Up (6) Down Closed loop convection control: Precise heating Cooling Programmable heat transfer Touchscreen interface Cooling zone PLC Computer Independent small cycling air circulation LED Aluminum circuit board Temperature control module Trouble alarm parameters Temperature abnormality Conveyor mesh width: 350 mm Maximum PCB width: 330 mm Conveyor direction: Left to right Conveyor speed: 0-670 mm/min Power consumption: 8 kW Precision temperature control: ±1° C Temperature distributing error: ±2° C Height of conveyor: 880 mm ± 20 mm Room temperature: 400° C Heating length: 2095 mm Transport system: Mesh Power supply: 220 V, Single phase 2014 vintage.
SMT F6 Reflow Oven is a powerful, high temperature assembly tool designed for soldering leaded, surface mount and through-hole components onto printed circuit boards (PCBs). This machine is capable of heating large boards very quickly and evenly, making for a reliable soldering system. F6 operates with an air-to-air process that uses convection, infrared (IR) and conduction heat sources to fill a chamber and circulate around the board, allowing every component to reach a uniform temperature. It also features an automatic three-stage preheat cycle to ensure optimal wetting action, followed by a five-stage profiled reflow cycle to properly solder all components to the board. Using advanced monitoring capabilities, SMT F6 Reflow Oven allows users to accurately and reliably control the entire soldering process from start to finish. For example, it has a powerful PID controller with three thermocouples that measure process temperatures, a pressure sensor to maintain proper atmospheric pressure, and an airflow meter to accurately monitor the flow of heated air. This oven also provides real-time monitoring of temperatures within different zones, off-line recipes, and the ability to select from different air velocities at each zone. All of this information can be tracked and displayed on the intuitive graphical user interface. F6 Reflow Oven is certified to meet the EN60721-3-5 and JIS C2040-5 standards, making it a powerful and reliable choice for high-volume production applications. The rugged stainless steel construction and the adjustable top and bottom pressure profiles for various board types provide users with the flexibility to set up the oven according to application requirements. This oven has an impressive maximum temperature of 300°C with a maximum board size of 506 mm x 762 mm, and features a programmable ramp-down rate of 20°C/second allowing for better control and shorter cooling time. In addition, SMT F6 offers customizable two-step nitrogen control for reducing oxidation and producing high-quality soldering results. In conclusion, F6 Reflow Oven is an ideal choice for anyone looking for a powerful, reliable and high-quality board processing machine. It is designed to soldering LCDs, LEDs, ICs and other electronics components onto a PCB with speed, efficiency, and accuracy. SMT F6's user-friendly interface and powerful features make it a perfect choice for any PCB manufacturing application.
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