Used TAMURA TNP-538EM #9251261 for sale

TAMURA TNP-538EM
Manufacturer
TAMURA
Model
TNP-538EM
ID: 9251261
Reflow ovens 2007 vintage.
TAMURA TNP-538EM is a high precision reflow oven used in production-level solder joint assembly operations. Featuring a 30-zone infrared heating configuration, the oven provides an even heat profile across each board for a consistent, reliable reflow process. For maximum efficiency, TNP-538EM also features a unique air-blast cooling equipment, providing a rapid cooling rate that reduces oxidation in the product. Additionally, multiple recipe setup functions are included to allow users to customize various temperature and conveyor speed inputs for efficient operation in any application. TAMURA TNP-538EM is equipped with a user friendly panel that makes it easy to view and adjust temperature settings. The independent control system allows operators to control up to 30 independent heating zones within the oven, providing a precise heat profile for any given circuit board. The heat profile can also be adjusted in multiple stages to ensure that all reflows are conducted at the same temperature with each cycle. The air-blast cooling unit and conveyor speed feature offer additional value for higher production runs. The conveyor speed allows users to set the belt speed to a specific value, while the air-blast cooling features a pressurized air jet to quickly cool the board when it reaches the end of the conveyor belt. This increases production accuracy and time savings, and ensures that delicate components are protected from oxidation. TNP-538EM also features powerful safety systems, including an automatic fire suppression machine and temperature alarms. The heat detectors act as a safety switch to immediately shut off the oven power when a dangerous rise in temperature occurs due to an internal malfunction. The fire suppression tool utilizes a combination of a water injection nozzle and a large air intake fan to quickly reduce fire hazards. In conclusion, TAMURA TNP-538EM is a precise, reliable reflow oven designed to meet the demands of production-level solder joint assembly operations. The 30-zone infrared heating configuration, air-blast cooling asset and automated safety systems all make TNP-538EM a powerful and dependable reflow oven for any circuit board manufacturing process.
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