Used TSM N30-I102S / N70-I130SH #9028584 for sale

TSM N30-I102S / N70-I130SH is a high-performance reflow oven that offers precise temperature control for superior quality soldering. It is ideal for use in PCB assembly, component assembly, and semiconductor packaging. N30-I102S / N70-I130SH features a dual-zone heating system that ensures precise and consistent temperatures. The top convection zone allows for thorough heat distribution over both sides of a PCB, while the bottom, indirect zone creates a thermal gradient to more precisely control the temperature of the board. This reduces the risk of excessive heating, minimizing the risk of damage to components and providing consistently high-quality soldering. TSM N30-I102S / N70-I130SH employs a sophisticated PID controller, allowing for fast, accurate temperature settings. This is adjustable and can be set to accommodate specific needs, such as smaller boards or larger ones to ensure accurate and consistent temperature throughout the reflow process. N30-I102S / N70-I130SH includes a preheater that significantly reduces solder joint melting time by allowing air to escape from around component areas on the PCB. This feature also helps to create a better quality solder joints, reducing the chances of voids and cold solder joints that can cause defects. TSM N30-I102S / N70-I130SH comes with a number of safety features, including an overheat alarm that warns the user if the temperature is too high, eliminating the risk of damage to the board or components. It also features a cooling tray with forced air flow, allowing for rapid cooling of the board after soldering. The complete package also includes a programming panel with intuitive, user-friendly controls. This allows the user to enter temperature settings and preheat times quickly and easily. In addition, a traceable system is included, allowing users to quickly access records of all their reflow processes in order to verify quality control.