Used TSM N70-i102SH #9161443 for sale

TSM N70-i102SH
Manufacturer
TSM
Model
N70-i102SH
ID: 9161443
Vintage: 2013
Reflow oven Right to Left (Front rail fixed) N2 (10) Heat zones (2) Cool zones Chain type 2013 vintage.
TSM N70-i102SH is a professional-grade reflow oven designed for high-volume chip placement and solder processes. It is an advanced semi-automatic equipment that offers a temperature range of 50-450°C and a cycle time of 10-50 seconds. N70-i102SH is equipped with a two-zone forced air convection system, as well as a fully programmable LCD touch screen control. With this advanced technology, users can easily set up and control the proper soldering conditions for each individual process. TSM N70-i102SH is constructed with an optimized non-contact temperature measurement unit, making it an excellent choice for lead-free and high temperature PWAs. The built-in temperature gradient control helps to ensure uniform heating across the entire board. This advanced oven also features an easy-to-use multi-program machine that allows up to 99 individual profiles and 5 test parameters. Additionally, the onboard computer can store up to 999 board and product profiles for future use. With N70-i102SH, users are able to select a variety of soldering functions, including fluxing, pre-singulation, wave soldering, and reflow. The built-in flux control tool provides precise application and gas flow rates, allowing users to maximize quality. To further improve the precision of each process, TSM N70-i102SH also features soldering height adjustments from 0-50 mm, depending on the PCB thickness. N70-i102SH is designed for fast, accurate, reliable, and consistent soldering. Boasting a large working area of 210mm x 320mm, TSM N70-i102SH also offers users the ability to quickly process up to 50 boards in a 8-hour shift. This allows users to quickly finish jobs, with a maximum production at 20 boards/hour. Overall, N70-i102SH is an advanced reflow oven designed for ultra-efficient soldering. It yields consistent results, with a fast cycle time and multi-function capabilities. The big working area and easy programing make it an ideal choice for high-volume chip placement and solder operations.
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