Used VITRONICS SOLTEC XPM3i 520 #9302285 for sale

VITRONICS SOLTEC XPM3i 520 reflow oven is a professional reflow oven designed for efficient, high-quality solder joint production with minimal thermal stress on sensitive components. It features full-digital and modular engineering with a fast response time to ensure immediate solder joint formation, as well as superior power, temperature, and speed accuracy for maximum control of the interconnect process. XPM3i 520 also incorporates intuitive, easy-to-use menus that allow for quick and easy setup and programming of the reflow oven. VITRONICS SOLTEC XPM3i 520 is a top-of-the-line reflow oven that features large components that are load-balanced for optimal performance and the most efficient reflow profile. This SMT reflow oven has overall dimensions of 351 mm W x 491 mm H x 781 mm D and weighs approx. 228 kg. It also features a maximum thermal capacity of 7.5 kW and a maximum process temperature of 315°C. XPM3i 520 also boasts a large 510 x 510 mm convection heating area with an independently controllable hot air fan, allowing for precise soldering of temperature-sensitive components. This reflow oven allows for uniform heating and cooling across the PCB, supporting convective and radiant heat transfer. It also features dual zone heaters for accurate temperature control with independent PID loop control over both zones. VITRONICS SOLTEC XPM3i 520 has a full-digital temperature controller with a PID algorithm for precise tuning of the temperature profile. It also incorporates a 3-dimensional wave soldering conveyor and infrared ceiling to evenly heat the component sides of PCBs. Its optical and acoustic signaling can also provide active feedback regarding the reflow profile. Overall, XPM3i 520 reflow oven is a reliable and cost-effective OEM solution for production of high-quality solder joints on SMT boards. Its innovative design and superior temperature accuracy provide accurate and repeatable reflow capabilities for a wide range of component types.