Used DEK 265 GS #9052113 for sale

DEK 265 GS is a precision screen printer designed for the demanding needs of the most advanced printed circuit board assembly and stencil printing operations. Its features have been developed to meet the requirements of high-volume production lines; the advanced machine design providing increased accuracy and repeatability of process and settings. DEK 265GS is a fully automated equipment that can handle a variety of board sizes and substrates. Its frame is constructed from machined aluminum and is designed to be highly rigid which allows for accurate precision motion control within its operating parameters. The axis of motion is achieved through four ball-screw motors and linear bearings, with servo motor controlled speed and duty cycle to optimize printing performance. 265 GS operates with a versatile direct image alignment system that ensures precise placement of the stencil compared to the printed circuit board. Through this unit, the stencil can be stored in memory and pattern parameters can be easily retrieved for accurate printing. The machine's operating table has a wide range of optional features designed to maximize efficiency. The support-rail machine utilized for the location of PCBs allows for rapid and secure placement. Both paste and surface pressure systems are used to ensure accurate transfer and placement of solder paste while the use of optical and option image registration systems is enabled for fine-pitch applications. Screen printing is achieved via a Teflon-coated squeegee blade that is mounted on an arm, driven through a servo motor and driven by a belt onto the stencil material. This arm follows the contoured surface of the board to ensure an even spread of material. An optional post-print inspection tool can be included to monitor for defects such as missing solder paste or misaligned stencils. The machine also has a fume extraction asset to ensure operator safety and cleanliness of the environment. 265GS is capable of operating in many different environments due to its range of flexible operational settings and temperature range form 40-70°C. This machine offers a reliable and efficient means of applying solder paste or other material consistently across a range of substrates and board sizes.