Used ESSEMTEC Tucano-USC-V #9246184 for sale
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ID: 9246184
Vintage: 2013
Screen printer
V 115 Alignment: Automatic dual camera vision system
Vision illumination color: Programmable red / Green / Blue LED
Alignment range: ±10 mm, ± 2.5°
Cycle time: 10 Seconds + print time
Print speed programmable: 1 - 250 mm/sec (0.039-9.84 inches/sec)
Process alignment capability: ± 25µm @ 6 Sigma
2013 vintage.
ESSEMTEC Tucano-USC-V is a highspeed, vision-controlled screen printer for printing and dispensing of assemble-ready components. This printer has been designed to meet high throughput requirements by providing superior accuracy and repeatability of ultra-precise placement and dispensing of components. Tucano-USC-V utilizes a precision printing process with optical-vision navigation, allowing it to trace fiducial markers for providing precise alignment of placement points with accuracy up to 10 µm. This screen printer is characterized by a variety of combinations of printing parameters including nozzles, paste clamps, and custom spraying techniques. The coating print section of this printer has the capacity to process either traditional varnish paste, solder paste, or silver-filled pastes, thus giving the user the opportunity to customize print recipes to fit the particular demands of their production. This printer also works off of an intelligent nozzle vectoring control system, which utilizes a high-speed, non-contacting laser to precisely land droplets of material on a PCB in strict accord with job settings. Additionally, the monitor processor promotes smoothness when manipulating servo-driven modules, as well as minimizes both setup time and machine lint. This printer is incredibly efficient and yields vast savings of time and money for its users. ESSEMTEC Tucano-USC-V has a wide range of smart features that give users complete control over the printing and dispensing process. This printer is further customizable with a variety of optional features available with purchase. The end result is an efficient and reliable machine that can easily handle multi-layer PCB's, LCP's, FPC's, and IC substrates to greatly reduce process time and cost in the production line.
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