Used TRIKON Sigma 200 #9225665 for sale

TRIKON Sigma 200 is a dry plasma etcher / asher specifically designed for the manufacture of advanced semiconductor devices. It provides superior performance for both etch and ash processes in a compact and affordable package. Sigma 200 efficiently etches volatile organic compounds (VOCs) from the surface of wafers, resulting in an extremely clean surface with minimal back etching. It is also capable of achieving a clean, high aspect ratio etch profile with a low operating cost. TRIKON Sigma 200 features a work chamber that is large enough to accommodate a wide range of wafer sizes. The chamber is equipped with an automatic loading equipment that is capable of handling up to 3-inch wafers and 25-millimeter wafers. An advanced process monitoring system monitors for any changes in the etching process. The unit is also capable of controlling etch and ash processes in pulsed and continuous mode. Sigma 200 is equipped with a rugged, all-metal design and a high-torque motor to achieve maximum productivity. The machine also provides excellent process control and repeatability over a wide range of loads. Various gas inputs are also available to suit the process requirements of different materials such as silicon, aluminum, glass, and other oxides. TRIKON Sigma 200 offers a variety of etch and ash processes. It is capable of both isotropic and anisotropic etching, with variable pressures, flow rates, and power levels to provide precision control over the process. The tool is also capable of achieving a high-aspect-ratio etch shape, which is often required for more advanced semiconductor devices. Additionally, the asset can be used for gate oxide etching, source and drain openings for memory cells, and contact openings for thin metal films. For those in need of an etcher / asher with excellent quality and flexibility, Sigma 200 is an ideal choice. Its small footprint, low operating costs, and excellent process control ensure that users get the most out of their etching and ash budgets.