Used TRIKON Sigma FxP #9253626 for sale
It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.
Tap to zoom
Sold
ID: 9253626
Wafer Size: 8"
Vintage: 2001
Metal deposition systems
Platen HSE MK2, 8" (P/N: TR-133072/B)
TI-Heater assy platen, 8" (P/N: 188855)
No Pumps / Chiller
Configuration:
Hot sputter etch chamber: Station 2 (DepE-HSE)
Station 0: BROOKS M800
Station 1: BROOKS VCE
Station 2: Hot sputter etch (Rack)
Station 3: Hot sputter etch (Rack)
Station 4: Deposition (Rack) TTN
Station 5: Deposition (Rack) TTN
Station 6: Deposition (Rack) ALU
Station 8: BROOKS VCE
Station 9: BROOKS Inliner
Station 10: BROOKS Top cooler
Station 11: BROOKS Buffer
(2) Load locks:
Station 1: VCEA
Station 8: VCEB
(3) Deposition chambers:
Station 3: (DepC- HU platen aluminium)
Station 4: (DepB - HiFill TTN)
Station 5: (DepA - HiFill TTN)
Pre heat chamber: Station 7
Orienter: Station 9 (In front of VCEA)
Top cooler for cooling wafers: Station 10 (In front of VCEB)
LEYBOLD CoolVac 1500 O-Ring sealed
Transport chamber
DC Power supplies for single and double rack
Turbo controller
Main computer
Main AC
RF / DC Power supplies
Chamber AC control
Temperature set point: 20°C
Resistivity set point: > 50 kΩ
Recirculating flow: 20 gpm
Recirculating pressure: 22 psi
BROOKS MAG7 Robot included
Process modules:
DepA
DepB
DepC and DepE
2001 vintage.
TRIKON Sigma FxP is an etcher and asher that was developed to provide precise control of plasma etching and ashing processes. It utilizes a fully integrated equipment from etching to plating to provide a powerful tool for industrial as well as research etcher and asher applications. The system can be used for various processes such as reactive ion etching (RIE), microwaves, reactive sputtering, and other etching and ashing processes. It consists of several components such as a vacuum chamber, a microwave generator, a robotic workstation, a plasma generator, and sputter source. The unit is fully automated and allows users to create optimized process recipes for different etching and ashing applications. Sigma FxP operates by using a combination of microwaves and radio frequencies to generate a plasma from the reaction chamber. This plasma provides a highly reactive environment, ideal for etching and ashing processes. The RIE chamber contains a quartz tube, a scattering media, a primary electrode, and a hazardous gas absorber. The microwaves are supplied from a magnetron and transmit energy to the reaction chamber. This energy is used to generate plasma inside the quartz tube. The gas inside the chamber is pressurized to achieve the ideal etching and ashing conditions. TRIKON Sigma FxP machine also includes a robotic workstation for optimizing the Different etching and ashing processes. This allows users to program the automated processes for repeatable results. Additionally, this tool has an automatic gas flow control asset for controlling the gas flow to the reaction chamber. Overall, Sigma FxP model is an effective tool for etching and ashing processes that is used in both research and industry. It provides great precision to the etching and ashing processes and as a result, optimized results. It allows users to optimize etching and ashing processes through its fully automated equipment and automated process programming. Furthermore, this system has a powerful gas flow control unit, which helps to provide an environment conducive to etching and ashing.
There are no reviews yet