Used ACCRETECH / TSK A-CS-100A #9238103 for sale

ACCRETECH / TSK A-CS-100A Wafer & Mask Scrubber is a machine used for cleaning and etching in the production of semiconductor devices. The machine is comprised of a rotating chamber that houses the wafer and a scrubbing arm that scrubs the surface of the wafer. The scrubbing arm is mounted to an automated arm that compresses clean wafers onto the rotating chamber. The rotation of the chamber creates a scrubbing motion that removes particles and oxide layers from the wafer surface. The cleaning process begins with the wafer being placed on the scrubbing arm. The scrubbing arm then performs a series of passes, applying an abrasive slurry mixture to the wafer surface. The slurry mixture is combined with an ultrasonic activation source and works to loosen and remove particles, oxides, and other residues from the wafer surface. The liquid used in the cleaning process is drained off and replaced with the final cleaning solution. This is an important stage of the process, as it rinses away any remaining residue left on the wafer surface. Any excess liquid is also collected and stored for reuse. The scrubbing arm is made up of two separate components - the brush assembly and the abrasive pad. The brush assembly is made up of flexible bristles that move in rapid, vertical motions to create an aggressive scrubbing effect. The abrasive pad is composed of silicone-based material and has a very low abrasion value so that it does not damage the delicate wafer surface. The scrubbing arm is connected to an I/O equipment which controls the speed and direction of the scrubbing arm's movement. This system is set up to control the operation in order to efficiently clean the wafer surface without damaging it. The scrubbing arm is retracted when the wafer has been sufficiently cleaned, then the parts are then unloaded from the chamber. TSK A-CS-100A Wafer & Mask Scrubber is a reliable and efficient machine for cleaning wafers for semiconductor production. The machine is designed to provide high-quality results with minimal damage to the wafer surface, allowing for more reliable operation of the semiconductor device. With its automated control unit, the machine can clean a variety of wafer formations quickly and efficiently. The machine utilizes a powerful scrubbing machine, combined with an ultrasonic activation source and abrasive pad, to remove particles and oxides from wafer surfaces, making it an invaluable tool in the semiconductor device production process.